XT V 130C - Cost-effective X-ray inspection of electronic components
The XT V 130C is a highly flexible and cost-effective electronics and semiconductor inspection system. The system features a 130 kV/10 watt Nikon Metrology manufactured source, a globally recognized open tube design with integrated generator, and a high-resolution imaging chain.
Through a series of factory and field upgrades, the end-user can configure these systems to their own needs with a higher power source, a rotating sample tray, automatic inspection software, a digital flat panel option, and the ability to add future-proof CT technology.
Proprietary 30-130 kv micro-focus source with 2μm feature recognition
True 75° manipulator tilting angle allows oblique viewing for easy inspection of internal features
Dual display for combined measurement and real-time analysis
Low cost of ownership and maintenance with open-tube technology
Safety as a design criterion
CT and X.Tract (laminography) ready
Benefits & features
Proprietary 30-130 kV micro-focus with 3μm spot size and 2μm feature recognition
The microfocus source is equipped with a transmission target, offering a 3 micron spot size. XT V 130C system uses a vertical mounted, open-tube X-ray source that guarantees a low cost-of-ownership. The advanced electromagnetic lens is computer controlled to ensure that the image remains in focus at all kV settings and the target does not burn when using highest powers
True parallel tracking for best views of BGA analysis
A combination of tilt and rotate is required to give the best unobstructed view of BGA balls. The next step is to scan along the rows to inspect for failures. With standard manipulators, this necessitates the simultaneous operation of 3 axes - requiring considerable skill on behalf of the operator.
Nikon's true parallel tracking maintains the X and Y axes parallel to the BGA, allowing the rows to be scanned using a single X or Y axis. This feature is enabled as part of the advanced system control concept.
True concentric imaging
The operator chooses a region of interest (ROI) to inspect and positions it in the centre of the screen. Under any combination of rotate, tilt and magnification, the ROI remains completely locked into the center of the field of view.
The true concentric imaging feature operates over the entire scan area of the manipulator. The ROI stays locked in, regardless of the sample’s position on the manipulator table, ideal for inspecting around single or multiple BGA balls.
BGA at tilt angle 0 degreesBGA at tilt angle 45 degreesBGA at tilt angle 60 degrees
High quality imaging chain reveals all defects
The XT V 130C system incorporates all features to generate high quality images from electronic samples
Leading proprietary micro-focus source technology
2400x image magnification enables users to zoom in on any specific item of interest
Range of detector options from Image Intensifiers to Digital Flat Panels
Accurate control of the power and direction of the emitted X-ray beams
Qualitative real time X-ray imaging
Zoom factor 5xZoom factor 16xZoom factor 150x
Comfortable measurement area of 520x520 mm
The measurement volume is easily accessible through a large hinged door and can easily hold larger boards or multiple components for automated inspection.
Intuitive software interface
The XT V 130C incorporates the most advanced image capture and analysis software running on the latest specification processing hardware. The resulting data can be saved or exported directly any COM compliant package e.g. Word, Excel, Access and SPC systems . Processing hardware and software are both controlled in-house so that advances in technology can be passed on to the user without delay.
Inspect-X includes special functions for inspection of semiconductor package voids, wire bonding and BGA solder bumps. It also makes use of Microsoft VBA as a scripting/macro language, allowing rapid software customisation to suit specific inspection requirements.
Low cost of ownership
Nikon’s open X-ray tube development has driven down the size, weight and cost of the system whilst maintaining superior quality and performance. By introducing a patented zero-maintenance cable-less HT generator, the preventative maintenance has been dramatically reduced making the long term cost of ownership considerably lower than any comparable system.
With a footprint of only two square metres, XT V 130C’s volume provides a generous 520 mm x 520 mm (20”x20”) scan area in a system.
Advanced ergonomics for ease of use
The XT V 130C has been designed for ease-of-use without compromising performance. A fully adjustable console arm ensures that all system controls are at the operator’s fingertips whether standing or sitting, independent of the operator’s height.
The Windows control screen is laid out logically with all regularly used functions in view on single click buttons while movement of the precision joysticks gives a direct and logical response from both sample manipulator and X-ray image. The system is highly intuitive to operate and as a result, operator training time is significantly reduced.
Ready for CT applications (option)
XT V 130C is pre-configured to turn the system into a CT system. This way 3D images can be reconstructed to gain even more insight into components and sub-assemblies.
Max. electron beam power
Open tube transmission target
Focal spot size
3 µm1 (below 2 W) 1; rising to 10 µm at 10W
Defect recognition capability
Up to 36,000x
Imaging system (Standard)
1.45 Mpixel 12-bit camera with 6" image intensifier
Imaging system (Option)
1.45 Mpixel 12bit camera with dual field 4”/6” image intensifier Varian 1313DX (1 Mpixel, 16-bit) Flatpanel Varian 2520DX (3 Mpixel, 16-bit) Flatpanel Dexela 1512 (3 Mpixel, 14-bit) Flatpanel
4-axis (X, Y, Z, T)
0 - 75 degrees
Largest square in single map 406x406 mm (16x16”) Absolute max 711x762 mm (28x30”)
Max. sample weight
5 kg (11 lbs)
Single 4k IPS (3840x2160 pixels)
Cabinet dimensions (WxDxH)
1200 x 1786 x 1916 mm (48.0 x 71.3 x 75.4”)
1,935 kg (4,266 lbs)
Inspect-X control and analysis software
Optional CT and/or X.Tract
Real-time inspection of electronics (BGA, µBGA, flip-chip and loaded PCB boards)
X-ray further increases product quality at Mentzer Electronics
Quality control at Mentzer Electronics in Burlingame, California, includes tracing electronics assembly issues using an XT V inspection system. This system allows quality engineers to navigate through the internal structure of assembled PCBs.
X-ray irons out electronic flaws at Process Sciences Inc.
Process Sciences Inc. (PSI) runs Nikon Metrology X-ray inspection to trace connectivity issues in electronic circuitry that otherwise remain hidden for the eye. Using intuitive real-time X-ray imaging, PSI collaborates with OEMs and contract assemblers nationwide to reveal and resolve weak points in their PCB manufacturing processes.