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One of Nikon's most advanced and versatile semiconductor inspection systems, the Optistation 3200 provides three-mode macro inspection capability – front, backside center, and backside perimeter – as well as high performance lighting techniques that allow for detection of a wide variety of process defects and particle/scratch detection.
Magnification | Numerical Aperture | Working Distance |
---|---|---|
5X | 0.15 | 18mm |
10X | 0.30 | 15mm |
20X | 0.45 | 4.50mm |
50X | 0.80 | 1.00mm |
100X | 0.90 | 1.00mm |
150X | 0.9 | 0.42mm |
Automated and motorized functions are controlled by an easily accessible touchscreen to ensure comfortable operation while minimizing contamination. Optimum observation settings, including aperture and light intensity, can be preset according to objective lens or wafer type.
Allows surface Macro, center backside Macro, and perimeter backside Macro inspections. Furthermore, the wide illuminator WIL-100 and the line illuminator LIL-100 have been newly developed to detect various process defects.
DART Software allows the operator to review and inspect files from one inspection station. With the software, images can be easily archived for later analysis.
Two load ports are available in the side or rear, making the OPTISTATION-3200 adaptable to diverse fab layouts and 300mm factory automation requirements.
Nikon’s renowned CFI60 optics produce crisp, clear images with high contrast and minimal flare. Longer working distances throughout the magnification range ensure safer wafer inspection. The darkfield signal-to-background ratio is three times higher than in the past, ensuring significantly better imaging.
The newly designed DUV microscope module supports 90nm and future design rules.
Wafer size: | OD 300mm |
---|---|
Microscope (micro) inspection: | Total magnification: 25x to 1500x; Inspection modes: Brightfield, Darkfield, DIC (option), DUV (option); Autofocus: LED illumination slit projection; Objectives: CFI60 objectives |
Macro inspection: | Surface Macro, center backside Macro, perimeter backside Macro |
Load port: | 2 FOUP; Position selectable from side or rear |
Wafer transfer: | Robotic handling; vacuum chuck; noncontact pre-alignment mechanism |
Options: | DUV microscope: Hg-Xe lamp type (248nm); Online operation: Via SECS-I or HSMS; Others: Video capture function, 2nd user interface (UIF), OHV (SEMI E84 compliance), Review inspection, ADC, OCR |
Safety: | S2-0302 compliance, CE marking compliance |
Ergonomic: | S8-0701 compliance |
Dimensions (W x D x H): | 1625 x 2500 x 2300mm; (Rear load port) (64.0 x 98.4 x 90.6 in.) |
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Brighton, MI 48116
United States
Email: sales.nm-us@nikon.com
Website: www.nikonmetrology.com
Telephone number: (810) 220-4360
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Irvine, CA 92618
United States
Email: sales.nm-us@nikon.com
Website: www.nikonmetrology.com
Telephone number: (949) 716-4440
8113 Ridgepoint Dr.
Irving, TX 75063
United States
Email: sales.nm-us@nikon.com
Telephone number: (810) 220-4360