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With the advent of many newer type components such as BGA and flip-chip devices; traditional microscope inspection is not an option as the majority of solder connections to the PCB are hidden from view. As such real-time X-ray images become more important than ever before.;
Soldering imperfections fall into the following categories:
The ease of seeing these defects depends on the image resolution. Defects as bridging and gross misalignment, are detectable with microscpes. Others, such as voiding, requires X-ray with a resolution down to one micron, and power in excess of 100W, particularly for devices such as micro-BGAs.
To detect dry joints high resolution (1 micron) high magnification (100X to 5.000X), complex sample manipulation (to tilt and rotate the PCB or the imaging system), and sophisticated image-processing software is required. XT V systems combine all these into one very user-friendly system. certain systems are avauilable with CT option for a full 3D insight into the electrical components.
Any OEM and supplier of electronic subsystems in consumer electronics, automotive, aerospace can enrich its inspection process by adopting X-ray and CT inspection systems.
Electronic and electrical components
Populated and unpopulated PCBs