 |
|
 |
Metris became a member of the Nikon group
|
|
|
|
A versatile microfocus x-ray analysis tool for both manual and programmed inspection of electronic components and PCB assemblies. The XT H 160 T has been developed in direct response to customers requirements using the latest materials technology and X-Tek’s 20 years of experience in the design and manufacture of x-ray apparatus
Maximum magnification - 6000x
An ultra thin output window design enables the sample to be placed safely within 250 microns of the focal spot giving up to 6000x system magnification. Thanks to the Hawk’s unique pyramid transmission x-ray target, the magnification of detail on large substrates and PCBs remains at an impressive level even at steep viewing angles.
High resolution - micron level features
A tightly controlled microfocus x-ray spot and the latest CCD imager technology ensure that the Hawk produces sharp images of micron level features even in the most challenging samples. The single pole electron lens is computer controlled to ensure that the image remains in focus at all kV settings and the target does not burn when using high power.
High penetration - 160kV
The Patented X-Tek Xi “Open Tube” x-ray source is smaller than any other design and allows x-ray images of fine detail in thick and dense samples to be seen with ease. This high energy vacuum de-mountable unit allows views at steep angles through solder joints and heatsinks without ever running out of energy.
|
|
|
|
 |
Viewing from any angle
The large carbon fibre tray moves under manual or programme control at up to 60mm/sec in both X and Y directions making the XT H 160 T highly suitable for batch production of smaller components and assemblies.
Trays loaded with samples onto custom fixturing can be snapped in and inspected using a vast library of machine vision functions linked together in quick and easy to compile routines.
With the tray replaced by two precision programmable rotation axes and a custom sample fixture with a scan area of up to 310mm x 500mm, sharp high magnification images from virtually 360 degrees around the sample can be produced.
For component package inspection, standard JEDEC sample trays or complete lots of IC strips can be located into the XT H 160 T's tray, dedicated software tools measure die attach void percentages and wire sweep rations.
For closer examination, individual strips and tubes can be rotated to expose delamination and wire loop problems.
|
Advanced ergonomics
The XT V 160 T has been designed for ease of use without compromising performance.
Fully adjustable shelves ensure that all system controls are at the operator’s fingertips whether standing or sitting, independent of the person’s height.
The Windows control screen is laid out logically with all regularly used functions in view on single click buttons while movement of the precision joysticks gives a direct and logical response from both sample manipulator and x-ray image.
The system is highly intuitive to operate and as a result, operator training time is significantly reduced.
| Integrated Inspect-X Software |
|
The XT V 160 T incorporates the most advanced image capture and analysis software. The resultant data can be saved or exported directly to MS Word, Excel and any other COM compliant package. Photo quality printouts can be made on a range of inkjet, laser or thermal printers.
Processing hardware and software are both controlled in-house so that advances in technology can be passed on to the user without delay.
Inspect-X includes special functions for inspection of semiconductor package voids, wire bonding and BGA solder bumps.
It also makes use of Microsoft Visual Basic as a scripting/macro language, allowing rapid software customisation to suit specific inspection requirements.
|
| Low cost of ownership |
 |
Footprint Efficient
The compact Xi source releases more of the XT V 160 T's volume for sample manipulation, providing a generous 20” x 14” scan area in a system footprint un-challenged by any other “open tube” x-ray system.
Low Ownership Cost
X-Tek’s open x-ray tube development has driven down the size, weight and cost of the system whilst maintaining superior quality and performance. By introducing a patented zero maintenance cable-less HT generator, the preventative maintenance has been dramatically reduced making the long term cost of ownership considerably lower than a sealed tube based system.
|
Features
This system is purpose built for volume inspection in a production environment, either in semiconductor packaging or PCB assembly. With a sample scan area of up to 350 x 530mm, the cabinet can accommodate large samples or trays of components.
- 2 or 5 µm Focal Spot Transmission Target X-Ray Source, 25 to 160 kV, 0 to 500 µA (non continuous) 10 Watt (5µm) or 20 Watt (2µm).
- 5kg Capacity 3 axis fully programmable manipulator, 2kg capacity Tilt and Rotate.
- Attachment gives 5 fully programmable axes.
- Maximum scan area 350 x 530mm (310 x 500mm with Tilt and Rotate Attachment)
- Geometric Magnification up to: 2400x.
- System Magnification up to: 5000x.
- Feature recognition: down to 1 micron.
- External Cabinet Dimensions: 1060mm L, 1350mm D, 1955mm H.
- Full system control and image processing software.
Applications
- Semiconductor Packaging
- Package Void inspection
- biological samples
- plastic samples
|
|
|
Product brochures
XT V Series - X-ray and CT technology for electronics inspection
|
|
|
|
|
|
Global site
