X-ray and CT technology for electronics inspection
To cope with the demands of ever-smaller electrical components and comply with tighter quality standards, Nikon Metrology introduced flexible, high-resolution and cost-effective inspection systems. High-precision proprietary X-ray technology built into the XT V 130C and XT V 160 X-ray inspection systems facilitate defect analysis of loaded PCB boards in a smooth non-destructive process. Designed for 100% BGA and μBGA inspection, multi-layer board inspection and PCB solder joint inspection, these compact, easy-to-use and cost-effective inspection systems are indispensable in any electronics production area.
Compact XT V 130 QA-system for affordable X-ray visualization and automated inspection
The XT V 130C is a highly flexible and cost-effective electronics and semiconductor inspection system.
The XT V 160 is specifically designed for x-ray inspection in production lines and failure analysis laboratories.
The XT V 160R is a versatile microfocus X-ray system for both manual and programmed inspection of electronics, semiconductor or small industrial samples.